Science Systems and Applications, Inc. - Science and Technology with Passion

 

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Semiconductor Fabrication Engineer
Reference #:21-3089
Open Date:4/23/2021
Location:Greenbelt, MD
US Citizenship Required:No
  
Job Description:

Science Systems and Applications, Inc. (SSAI) is looking for a full-time Semiconductor Fabrication Engineer on the Electrical Systems Engineering Services III (ESES III) contract at NASA Goddard Space Flight Center (GSFC) supporting the Detector Systems Branch. The fabrication engineer will primarily provide fabrication support for bolometric type detector technology, currently under development for future space flight science instruments. The engineer will receive on-the-job-training on the specific silicon wafer processing techniques and equipment used in NASA GSFC Detector Systems Branch facilities.

The ESES III contract includes the provision of electrical/electronic engineering support services and related work to the Engineering and Technology Directorate. The work includes the study, design, development, fabrication, integration, testing, verification and operations of spaceflight, airborne and ground system hardware and software, including development and validation of new technologies to enable future space and science missions.

The Semiconductor Fabrication Engineer will provide on-site support to NASA Detector Systems Branch. The engineer will receive on-the-job-training on the specific silicon wafer processing techniques and equipment used in NASA GSFC Detector Systems Branch facilities.

Specific duties for this position may include the following:

  • Depositing and patterning of metallic or superconducting thin films via sputtering and e-beam evaporation deposition techniques, photo-resist spinning, contact-based photolithography, stepper-lithography, laser-writing-lithography, e-beam lithography, wet-etching, reactive-ion-etching and liftoff patterning techniques.
  • Aligning and bonding of silicon wafers.
  • Use of a furnace and oven for thermal oxidation and annealing processes.
  • Deep reactive ion etching (DRIE) or reactive ion-etching (RIE) of silicon substrates.
  • Metrology and imaging of completed or in-process devices using a profilometer, optical microscope, SEM, or AFM.
  • Measurements of thin film electrical properties using a 4-point probe.
  • Developing new patterning or process techniques as required to meet specified device design criteria.
  • Working in a clean room environment and following good practices to maintain the clean room environment.
  • Maintaining a high attention to detail, including the ability to precisely follow detailed process instructions from a run sheet, and to inspect and report on details of results after each processing step.
  • Demonstrating excellent communication skills, including providing clear verbal and written communication and documentation of fabrication process results and status reports to project team members, during informal and formal group meetings and via email.
  • Displaying initiative and working independently on project tasks, while also working effectively with other project team members and with other laboratory team members to coordinate wafer processing, use of lab equipment, training on equipment, and/or to transfer knowledge of processing techniques.
  • Managing time effectively to meet project deadlines.
Required Qualifications:
  • BS in either a materials science, physics or engineering field and 2-5 years relevant experience, or equivalent combination of education and experience
  • Proven experience and demonstrated success as a Semiconductor Fabrication Engineer or in a position requiring related experience to the duties listed above.
  • Able to work in a team environment
  • Must be US citizen or permanent resident
Desired Qualifications:
  • MS or PhD in either a materials science, physics or engineering field
  • Prior NASA or industry experience